Micro-Joining Systems For Electronic Circuits And Encapsulating Elements Of Micro-Sensors And Actuators

Program:  National Plan for Research, Development and Innovation II

Project manager: Dr. Danut SAVU

Project start: 15.09.2007                           Project end: 31.05.2010


  • NRDI for Welding and Material Testing (ISIM) Timisoara – project coordinator

  • NRDI for Microtechnology (IMT) Bucharest

  • NRDI for Laser, Plasma and Radiation Physics (INFLPR) Bucharest

  • University of Craiova – Faculty of Engineering and Management of the Technological Systems (UCV-IMST)

  • S.C. Centre for Advanced Technologies and Failure Investigation – TARD S.R.L. Dr.Tr. Severin

  • S.C. BRAINS S.R.L. Craiova

  • S.C. LAMDRO S.A Dr.Tr.Severin

The aim of the project scope is the development of the knowledge in the field of the micro-assembling (microbonding and micro-welding) of the structural components of MEMS, with direct effect in the development of the fundamental research, in order to achieve the advanced knowledge in one of the European strategic directions: nanoscience and nanotechnology.

Micro sensors and actuators industry showed an accelerate growth starting within the last 5 years. The functionality of these electromechanical micro-devices is based on different electromechanical phenomena and that gives importance to the electrical connections. In the same time the active elements of some actuators types need special conditions for appropriate functioning, so they are usually insulated by special packaging. Such insulated packaging is possible by creating joining surfaces with special characteristics. So, it does exist two main micro-welding processing types for the MEMS’ components: micro-welds for electrical connections with low contact resistance and micro-welds for packaging of the active components of the MEMS.

The main scope of the research is the development of new micro-welding systems with multiple functions, systems that can be applied to the packaging and the assembling of the MEMS’ components. To apply these micro-welding systems it will be in attention the components of the electrical microcircuits, the insulating elements of the micro-sensors and actuators, as well. These micro-welding systems define itself as innovative solutions for old systems replacement, with low efficiency and sometimes impossible to apply, to classical assembling at microproducts level. The project approach the micro-processing theme for rapid and precise assembling of determined components that are manufactured by special materials, sometimes with manipulated structure at nanometric level.

Results of project in progress:

  1. Establishing metals and alloys which together with the base materials of the MEMS’ elements, forms eutectics at the lower temperatures than melting temperature of the base material.

  2. Development of specific 3D micro-machining processes that can be applied on the masks that are used for selective heating of the base materials during microwelding.

  3. Geometrical and dimensional parameters optimization of the laser beam during the masked-heating of the joining micro-surfaces.

  4. Development of specialized sonotrodes for optimized thermosonic welding

  5. Guidelines for micro-joining processes application.


Contact person: dr. Danut SAVU (disavu@isim.ro)